Talk Title: On Refining Standard Cell Detailed Placement for Self-Aligned Double Patterning

报告时间：2017年3月23日，10:00am-11:00am

报告地点：数计学院2号楼309

Abstract:

As process nodes continue to advance, self-aligned double patterning (SADP) hasbecome one of the most promising lithographytechniques. Existingworks for SADP focus more on layout decomposition and routing, while very fewattempts are on placement. In this talk, the problem of refining a standard cell detailed placement forSADP will be introduced. The addressed problem asks to simultaneously refine a detailed placement and find a validSADP layout decomposition such that both overlay violation and wirelength areas small as possible.Overlay violation is a crucial issue for SADP, and therefore how to minimize it is important. Based on the techniques of white space insertion and cellflipping, an approach to the addressed placement refinement problem will be presented and its efficacy will be shown by experimental results.

Speaker Bio:

Ting-Chi Wang received the B.S. degree in Computer Science and Information Engineering from National Taiwan University, Taipei, Taiwan, and the M.S. and Ph.D. degrees in Computer Sciences from the University of Texas at Austin, USA. He is currently a Professor in the Department of Computer Science and the Director of Institute of information Systems and Applications, National Tsing Hua University, Hsinchu, Taiwan. His major research interest is in VLSI physical design automation.

Dr. Wang received Best Paper Awards respectively from 2006 ASP-DAC and 2015 ISPD for his works on redundant via insertion and triple patterning layout decomposition. He supervised a team to win the first place at 2008 ISPD Global Routing Contest. He was the General Chair of 2015 SASIMI and served on the technical program committees of major EDA conferences, including ASP-DAC, DAC, DATE, ICCAD, and ISPD. He was an Associate Editor of ACM TODAESin 2013-2016.